US 11,756,712 B2
Sensor device and method for manufacturing a sensor device
Alfred Hofrichter, Hartberg (AT); and Thomas Feichtinger, Graz (AT)
Assigned to TDK Electronics AG, Munich (DE)
Appl. No. 17/597,059
Filed by TDK Electronics AG, Munich (DE)
PCT Filed Aug. 14, 2020, PCT No. PCT/EP2020/072850
§ 371(c)(1), (2) Date Dec. 23, 2021,
PCT Pub. No. WO2021/052690, PCT Pub. Date Mar. 25, 2021.
Claims priority of application No. 102019125340.3 (DE), filed on Sep. 20, 2019.
Prior Publication US 2022/0246335 A1, Aug. 4, 2022
Int. Cl. H01C 7/18 (2006.01); G01K 7/22 (2006.01); H01C 7/04 (2006.01); H01C 17/00 (2006.01)
CPC H01C 7/18 (2013.01) [G01K 7/22 (2013.01); H01C 7/04 (2013.01); H01C 17/006 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A sensor device comprising:
a sensor chip comprising a plurality of printed ceramic layers and unprinted ceramic layers;
at least one termination layer configured to make electrical contact with an electrically conductive material,
wherein the termination layer is formed at least on a top side and/or on a bottom side of the sensor chip,
wherein the printed ceramic layers are at least partially printed with an electrically conductive material, and
wherein an electrical resistance of the sensor chip is determined by an overlap area of the electrically conductive material or by a distance of the electrically conductive material from the termination layer; and
at least one damping layer directly located at at least a partial area of an outer surface of the sensor chip,
wherein the at least one damping layer comprises a material which has a greater elasticity than a material of the termination layer, and
wherein the at least one damping layer comprises a conductive polymer.