CPC G02B 30/25 (2020.01) [H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01)] | 15 Claims |
1. A method of manufacturing polarized light emitting semiconductor packages, comprising:
disposing a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits polarized light in a first directionality, and;
disposing a second bonding solution about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality;
applying a first energy to polymerize the first and second bonding solution, thereby encapsulating the first and second polarizing element and a first and second light emitting element in a first semiconductor package.
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