US 11,754,852 B2
Encapsulation of polarized light emitters
Nathaniel Huber, Hollywood, CA (US)
Assigned to Liminal Space, Inc., Los Angeles, CA (US)
Filed by Liminal Space, Inc., Los Angeles, CA (US)
Filed on Dec. 12, 2022, as Appl. No. 18/79,713.
Application 18/079,713 is a continuation of application No. 16/557,900, filed on Aug. 30, 2019, granted, now 11,543,676.
Prior Publication US 2023/0109166 A1, Apr. 6, 2023
Int. Cl. G02B 30/25 (2020.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01)
CPC G02B 30/25 (2020.01) [H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of manufacturing polarized light emitting semiconductor packages, comprising:
disposing a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits polarized light in a first directionality, and;
disposing a second bonding solution about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality;
applying a first energy to polymerize the first and second bonding solution, thereby encapsulating the first and second polarizing element and a first and second light emitting element in a first semiconductor package.