CPC C22C 1/045 (2013.01) [C22C 27/04 (2013.01); C23C 14/185 (2013.01); C23C 14/3407 (2013.01); C23C 14/3414 (2013.01); C23C 14/5873 (2013.01); G06F 3/041 (2013.01); B22F 2998/10 (2013.01); G06F 2203/04103 (2013.01); Y10T 428/12743 (2015.01); Y10T 428/12826 (2015.01); Y10T 428/265 (2015.01); Y10T 428/31678 (2015.04)] | 17 Claims |
1. A sputter target that is sputterable to form a film comprising an alloy, the sputter target comprising molybdenum, titanium, vanadium, chromium, tantalum, and niobium,
wherein (i) a total concentration of molybdenum, titanium, vanadium, chromium, tantalum, and niobium in the sputter target is 99 atomic percent or more, based on the total number of atoms in the sputter target, and (ii) the sputter target contains at least 50 atomic percent molybdenum.
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