US 11,753,258 B2
Solids conveying with multi-diameter piping circuit
Shady Henry, La Porte, TX (US); and Ronald Lutz, Pasadena, TX (US)
Assigned to Braskem America, Inc., Philadelphia, PA (US)
Filed by Braskem America, Inc., Philadelphia, PA (US)
Filed on Sep. 23, 2021, as Appl. No. 17/482,839.
Application 17/482,839 is a continuation of application No. 16/904,334, filed on Jun. 17, 2020, granted, now 11,161,699.
Claims priority of provisional application 62/863,040, filed on Jun. 18, 2019.
Prior Publication US 2022/0009728 A1, Jan. 13, 2022
Int. Cl. B65G 53/52 (2006.01); B65G 53/06 (2006.01)
CPC B65G 53/06 (2013.01) [B65G 53/528 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A piping circuit for conveying particles comprising:
a first segment comprising an intersection where particles dispersed in a first gas combine with a second gas form a mixture, a cross sectional area inside the first segment strategically sized so that when the mixture flows through the first segment the particles are at a velocity at least as great as a pick up velocity of the particles, the intersection comprising a junction where a first pipe carrying the first gas and the particles joins directly with a second pipe carrying the second gas so that the first gas and particles are introduced directly into a flow of the second gas within the second pipe; and
a second segment comprising an upstream end in communication with the first segment, a terminal end distal from the upstream end, and a cross sectional area greater than the cross sectional area of the first segment and strategically sized so that when the mixture flows through the second segment the particles are at a velocity at least as great as a saltation velocity of the particles.