US 11,752,770 B2
Liquid ejection head
Hiroshi Higuchi, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Feb. 16, 2022, as Appl. No. 17/673,115.
Claims priority of application No. 2021-030364 (JP), filed on Feb. 26, 2021.
Prior Publication US 2022/0274406 A1, Sep. 1, 2022
Int. Cl. B41J 2/16 (2006.01); B41J 2/14 (2006.01)
CPC B41J 2/1623 (2013.01) [B41J 2/14201 (2013.01); B41J 2/1618 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A liquid ejection head comprising:
a first substrate including a structure; and
a second substrate bonded to the first substrate with an adhesive,
wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and
wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.