CPC B23P 19/06 (2013.01) [B25B 23/10 (2013.01); B25J 15/0019 (2013.01); H01L 21/6732 (2013.01); Y10T 29/49819 (2015.01)] | 20 Claims |
1. A method of removing a fastener from a wafer carrier, the method comprising:
moving a robotic arm to position a screw tool assembly over the fastener,
such that a lower sleeve element of the screw tool assembly surrounds a head of the fastener, the lower sleeve element including an internal thread having at least one turn;
pushing the screw tool assembly downwards such that the lower sleeve element is pushed into an upper sleeve element of the screw tool assembly and a screw drive of the fastener is engaged by a screwdriver head within the upper sleeve element; and
unscrewing the fastener by rotating the screwdriver head with a motor,
such that the head of the fastener is captured by the internal thread of the lower sleeve element and separated from the wafer carrier.
|