US 11,752,582 B1
Methods for removing a fastener from a wafer carrier
Yu-Chen Chen, Hemei Township (TW); Chih-Hung Huang, Hsinchu (TW); Cheng-Lung Wu, Zhunan Township (TW); Yang-Ann Chu, Hsinchu (TW); and Jiun-Rong Pai, Jhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Hsinchu (TW)
Filed on Feb. 15, 2022, as Appl. No. 17/671,795.
Int. Cl. B23P 19/06 (2006.01); H01L 21/673 (2006.01); B25J 15/00 (2006.01); B25B 23/10 (2006.01)
CPC B23P 19/06 (2013.01) [B25B 23/10 (2013.01); B25J 15/0019 (2013.01); H01L 21/6732 (2013.01); Y10T 29/49819 (2015.01)] 20 Claims
OG exemplary drawing
 
1. A method of removing a fastener from a wafer carrier, the method comprising:
moving a robotic arm to position a screw tool assembly over the fastener,
such that a lower sleeve element of the screw tool assembly surrounds a head of the fastener, the lower sleeve element including an internal thread having at least one turn;
pushing the screw tool assembly downwards such that the lower sleeve element is pushed into an upper sleeve element of the screw tool assembly and a screw drive of the fastener is engaged by a screwdriver head within the upper sleeve element; and
unscrewing the fastener by rotating the screwdriver head with a motor,
such that the head of the fastener is captured by the internal thread of the lower sleeve element and separated from the wafer carrier.