US 11,752,581 B2
Multi-purpose heat sink, method of manufacturing the same, board card, and multi-purpose heat sink platform
Chongxing Zhu, Beijing (CN); Huijun Lan, Beijing (CN); Kun He, Beijing (CN); Kai Ye, Beijing (CN); Deheng Chen, Beijing (CN); and Shuai Chen, Beijing (CN)
Assigned to CAMBRICON TECHNOLOGIES CORPORATION LIMITED, Beijing (CN)
Filed by Cambricon Technologies Corporation Limited, Beijing (CN)
Filed on Dec. 13, 2019, as Appl. No. 16/714,678.
Claims priority of application No. 201910471371.0 (CN), filed on May 31, 2019.
Prior Publication US 2020/0376614 A1, Dec. 3, 2020
Int. Cl. F28F 7/00 (2006.01); B23P 15/26 (2006.01); F28F 3/12 (2006.01); F28D 15/02 (2006.01); F28D 21/00 (2006.01)
CPC B23P 15/26 (2013.01) [F28F 3/12 (2013.01); B23P 2700/10 (2013.01); F28D 15/0275 (2013.01); F28D 2021/0029 (2013.01); F28F 2215/00 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A manufacturing method of a multi-purpose heat sink, comprising:
providing a platform part, wherein the platform part includes a bracket and heat dissipation components, and the bracket limits a frame of the platform part and includes a primary panel; and
providing an additional part, wherein the additional part includes a plurality of types of convex plates,
wherein at least part of the heat dissipation components are set on a back side of the primary panel of the bracket, and the plurality of convex plates are combined with a front side of the primary panel and are used for heat conduction in contact with heat dissipation sources of a corresponding circuit board assembly, the platform part is capable of receiving more than one type of convex plates,
selecting one from the plurality of convex plates from multiple candidate convex plates for one of the heat dissipation sources according to an arrangement of the heat dissipation sources of the corresponding circuit board assembly,
wherein the selected convex plate includes a flat surface in contact with a surface of a corresponding one of the heat dissipation sources, and
wherein the flat surface of the selected convex plate is of a same shape as the surface of the corresponding one of the heat dissipation sources.