| US 7,589,967 B2 | ||
| Heat dissipation device | ||
| Shi-Wen Zhou, Shenzhen (China); Guo Chen, Shenzhen (China); Peng Liu, Shenzhen (China); and Chun-Chi Chen, Taipei Hsien (Taiwan) | ||
| Assigned to Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan) | ||
| Filed on Dec. 01, 2006, as Appl. No. 11/566,025. | ||
| Prior Publication US 2008/0130228 A1, Jun. 05, 2008 | ||
| Int. Cl. H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01) | ||
| U.S. Cl. 361—697 [361/695; 361/710; 165/80.3; 165/185; 174/16.3; 257/718; 257/719; 257/722] | 14 Claims |
| 1. A heat dissipation device comprising:
a heat sink for contacting a heat-generating component, the heat sink comprising a solid core having an axis substantially
perpendicular to the heat-generating component, and a plurality of fins outwardly and radially extending from the core;
a plurality of holders connected with fins of the heat sink;
a fan comprising a frame and a motor received in the frame, the fan having an intake, the frame having a top level and a bottom
level, an airflow generated by the fan and flowing through the heat sink; and
an anti-backflow plate mounted between the top level and the bottom level of the fan, the anti-backflow plate extending outwardly
and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of
the fan;
wherein each of the holders defines an opening communicating with a channel defined between two of the fins, and a plurality
of self-tapping screws extend through the anti-backflow plate, the fan and the openings of the holders in series to threadedly
engage with corresponding fins.
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