| US 7,589,952 B2 | ||
| Multilayer electronic device and method for manufacturing the same | ||
| Akihiro Motoki, Fukui (Japan); Kenichi Kawasaki, Echizen (Japan); Makoto Ogawa, Fukui (Japan); Shigeyuki Kuroda, Sabae (Japan); and Tatsuo Kunishi, Moriyama (Japan) | ||
| Assigned to Murata Manufacturing Co., Ltd., Kyoto (Japan) | ||
| Filed on Apr. 25, 2008, as Appl. No. 12/109,371. | ||
| Application 12/109371 is a continuation of application No. PCT/JP2007/068624, filed on Sep. 26, 2007. | ||
| Claims priority of application No. 2006-315074 (JP), filed on Nov. 22, 2006. | ||
| Prior Publication US 2008/0225462 A1, Sep. 18, 2008 | ||
| Int. Cl. H01G 4/228 (2006.01) | ||
| U.S. Cl. 361—306.3 [29/25.42] | 5 Claims |
| 1. A method for manufacturing a multilayer electronic device, comprising the steps of:
preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes
formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface
of the laminate; and
forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes
which are exposed at the predetermined surface of the laminate; wherein
the step of forming an external electrode includes the steps of:
adhering conductive particles having a particle diameter of about 1 μm or more to the predetermined surface of the laminate
which is prepared in the step of preparing a laminate; and
performing plating directly on the predetermined surface to which the conductive particles are adhered.
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