| US 7,589,951 B2 | ||
| Laminated electronic component and method for manufacturing the same | ||
| Tatsuo Kunishi, Moriyama (Japan); Makoto Ogawa, Fukui (Japan); and Akihiro Motoki, Fukui (Japan) | ||
| Assigned to Murata Manufacturing Co., Ltd., Kyoto (Japan) | ||
| Filed on Feb. 13, 2008, as Appl. No. 12/30,360. | ||
| Application 12/030360 is a continuation of application No. PCT/JP2007/051900, filed on Feb. 05, 2007. | ||
| Claims priority of application No. 2006-051218 (JP), filed on Feb. 27, 2006. | ||
| Prior Publication US 2008/0123249 A1, May 29, 2008 | ||
| Int. Cl. H01G 4/228 (2006.01) | ||
| U.S. Cl. 361—306.3 [361/309; 29/25.42] | 10 Claims |
| 1. A method for manufacturing a laminated electronic component comprising the steps of:
preparing a laminated body including a plurality of laminated insulator layers and a plurality of internal electrodes extending
along surfaces of the insulator layers, wherein end portions of the internal electrodes are exposed at a predetermined surface
of the laminated body; and
forming an external electrode on the predetermined surface of the laminated body to electrically connect the end portions
of the plurality of the internal electrodes being exposed at the predetermined surface of the laminated body to each other;
wherein
in the laminated body prepared in the step of preparing the laminated body, at the predetermined surface at which the internal
electrodes are exposed, the internal electrodes are electrically isolated from adjacent internal electrodes, and a distance
between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of
the insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the predetermined
surface;
the step of forming the external electrode includes a step of electroless plating, wherein the electroless plating with plating
solution including a reducer is performed directly on the end portions of the plurality of the internal electrodes being exposed
at the predetermined surface of the laminated body prepared in the step of preparing the laminated body; and
the step of electroless plating includes a step of growing plating deposits formed at the end portions of the plurality of
the internal electrodes to connect each other.
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