US 7,589,419 B2
Side connectors for RFID chip
Robert R. Oberle, Macungie, Pa. (US)
Assigned to RCD Technology, Inc., Quakertown, Pa. (US)
Filed on Aug. 01, 2007, as Appl. No. 11/832,246.
Claims priority of provisional application 60/821618, filed on Aug. 07, 2006.
Prior Publication US 2008/0029897 A1, Feb. 07, 2008
Int. Cl. H01L 23/34 (2006.01); H01L 23/48 (2006.01)
U.S. Cl. 257—728  [257/773; 257/786; 257/E23.02] 10 Claims
OG exemplary drawing
 
1. A Radio Frequency Identification (RFID) chip comprising:
a RFID circuit having first and second bond pads on a top surface of the RFID chip; and
conductive paths on the top surface of the RFID chip connecting the first and second bond pads along two opposite sides of the RFID chip respectively, the conductive paths including a first side connector on a first side of the two opposite sides on the top surface of the RFID chip electrically connected to the first bond pad and a second side connector on a second opposite sides on the top surface of the RFID chip connected to the second bond pad, wherein the first and the second side connectors protrude from the top surface of the RFID chip entirely covering two opposite side lengths of the respective opposite sides on the top surface the top of the RFID chip.