| US 7,589,408 B2 | ||
| Stackable semiconductor package | ||
| Gwo-Liang Weng, Kaohsiung (Taiwan); Yung-Li Lu, Kaohsiung (Taiwan); and Cheng-Yin Lee, Kaohsiung (Taiwan) | ||
| Assigned to Advanced Semiconductor Engineering, Inc., Kaohsiung (Taiwan) | ||
| Filed on Dec. 12, 2006, as Appl. No. 11/636,993. | ||
| Claims priority of application No. 95119249 A (TW), filed on May 30, 2006. | ||
| Prior Publication US 2007/0278640 A1, Dec. 06, 2007 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—686 [257/777; 257/787] | 20 Claims |
| 1. A stackable semiconductor package, comprising:
a first substrate having a first surface and a second surface;
a semiconductor device disposed on the first surface of the first substrate, and electrically connected to the first surface
of the first substrate;
a second substrate disposed above the semiconductor device, and having a first surface and a second surface, wherein the first
surface of the second substrate has a plurality of first pads and a plurality of second pads disposed thereon, and an area
of the second substrate is larger than that of the semiconductor device;
a plurality of first wires electrically connecting the first pads of the second substrate to the first surface of the first
substrate;
a supporting element disposed between the first surface of the first substrate and the second surface of the second substrate,
so as to support the second substrate, wherein the supporting element is an annular sidewall, which encloses a space to accommodate
the semiconductor device; and
a first molding compound encapsulating the first surface of the first substrate, the semiconductor device, the first wires,
the supporting element, and a portion of the second substrate, and exposing the second pads on the first surface of the second
substrate, wherein the annular sidewall has a plurality of through holes for facilitating flow of the first molding compound.
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