| US 7,589,403 B2 | ||
| Lead structure for a semiconductor component and method for producing the same | ||
| Michael Bauer, Nittendorf (Germany); Angela Kessler, Regensburg (Germany); Wolfgang Schober, Amberg (Germany); Alfred Haimerl, Sinzing (Germany); and Joachim Mahler, Regensburg (Germany) | ||
| Assigned to Infineon Technologies AG, Neubiberg (Germany) | ||
| Filed on Oct. 29, 2007, as Appl. No. 11/927,239. | ||
| Application 11/927239 is a continuation of application No. PCT/DE2006/000722, filed on Apr. 25, 2006. | ||
| Claims priority of application No. 10 2005 020 453 (DE), filed on Apr. 29, 2005. | ||
| Prior Publication US 2008/0224301 A1, Sep. 18, 2008 | ||
| Int. Cl. H01L 23/495 (2006.01) | ||
| U.S. Cl. 257—676 [257/687; 977/938] | 10 Claims |
| 1. A lead structure for a semiconductor component, the lead structure comprising:
a plastic housing composition;
external leads configured to be externally connected to outside the plastic housing composition;
internal leads configured to be electrically connected to within the plastic housing composition, the internal leads including
contact pads;
a chip mounting island comprising lead material, the chip mounting island being configured to apply a semiconductor chip;
and
a plurality of nanotubes anchored on top sides of the chip mounting island and the internal leads, the plurality of nanotubes
being arranged with interspaces between nanotubes and such that the contact pads of the internal leads are free of nanotubes;
and
an adhesive composition arranged in the interspaces between the nanotubes anchored on the chip mounting island, the adhesive
composition filling the interspaces in a manner free of voids;
wherein the plastic housing composition is arranged in the interspaces between the nanotubes anchored on the internal leads,
the plastic housing composition filling the interspaces in a manner free of voids.
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