| US 7,588,968 B1 | ||
| Linked chip attach and underfill | ||
| Edward A Zarbock, Gilbert, Ariz. (US); Ming Lei, Chandler, Ariz. (US); and Sabina Houle, Phoenix, Ariz. (US) | ||
| Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
| Filed on Mar. 31, 2008, as Appl. No. 12/59,047. | ||
| Int. Cl. H01L 21/48 (2006.01) | ||
| U.S. Cl. 438—127 [438/108; 257/E21.503] | 9 Claims |
| 1. A method comprising:
placing an integrated circuit onto a package substrate;
performing reflow to attach the integrated circuit to the package substrate;
maintaining the temperature of the integrated circuit and package assembly at or above a predetermined temperature prior to
dispensing an underfill between the package substrate and the integrated circuit;
dispensing an underfill material between the package substrate and the integrated circuit;
curing the underfill material to a first level of curing in the integrated circuit and package assembly;
cooling the underfill material in the integrated circuit and package assembly; and
curing the underfill material to a second level of curing wherein the second level of curing is greater than the first level
of curing.
|