| US 7,588,413 B2 | ||
| Upstream plasma shielded film cooling | ||
| Ching-Pang Lee, Cincinnati, Ohio (US); Aspi Rustom Wadia, Loveland, Ohio (US); David Glenn Cherry, Loveland, Ohio (US); and Je-Chin Han, College Station, Tex. (US) | ||
| Assigned to General Electric Company, Schenectady, N.Y. (US) | ||
| Filed on Nov. 30, 2006, as Appl. No. 11/606,971. | ||
| Prior Publication US 2008/0128266 A1, Jun. 05, 2008 | ||
| Int. Cl. F01D 25/12 (2006.01) | ||
| U.S. Cl. 415—115 [415/914; 416/97 R; 60/757] | 27 Claims |
| 1. An upstream plasma boundary layer shielding system comprising:
film cooling apertures disposed through a wall,
the film cooling apertures angled in a downstream direction from a cold surface of the wall to an outer hot surface of the
wall, and
a plasma generator located upstream of the film cooling apertures for producing a plasma extending over the film cooling apertures.
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