| US 7,587,812 B2 | ||
| Electronic device manufacturing component with an embedded chip and methods of using the same | ||
| William Allan Bagley, Tokyo (Japan); Paohuei Lee, Fremont, Calif. (US); Suhail Anwar, San Jose, Calif. (US); and Janusz Jozwiak, San Ramon, Calif. (US) | ||
| Assigned to Applied Materials, Inc., Santa Clara, Calif. (US) | ||
| Filed on Feb. 07, 2007, as Appl. No. 11/672,441. | ||
| Claims priority of provisional application 60/771227, filed on Feb. 07, 2006. | ||
| Prior Publication US 2007/0197062 A1, Aug. 23, 2007 | ||
| Int. Cl. H01R 13/04 (2006.01) | ||
| U.S. Cl. 29—729 | 20 Claims |
| 1. A processing chamber for manufacturing one or more devices, comprising:
a component for use during a process for manufacturing one or more devices performed within the processing chamber; and
a chip embedded within the component, wherein the chip is adapted to store or update at least one of identification, operational-related
and process-related information associated with the component;
wherein the one or more devices are different from the component and the chip.
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