| US 7,586,758 B2 | ||
| Integrated circuit stacking system | ||
| James W. Cady, Austin, Tex. (US); James Wilder, Austin, Tex. (US); David L. Roper, Austin, Tex. (US); Russell Rapport, Austin, Tex. (US); James Douglas Wehrly, Jr., Austin, Tex. (US); and Jeffrey Alan Buchle, Austin, Tex. (US) | ||
| Assigned to Entorian Technologies, LP, Austin, Tex. (US) | ||
| Filed on Oct. 05, 2004, as Appl. No. 10/958,924. | ||
| Application 10/958924 is a continuation of application No. 10/136890, filed on May 02, 2002, granted, now 6,940,729. | ||
| Application 10/136890 is a continuation in part of application No. 10/005581, filed on Oct. 26, 2001, granted, now 6,576,992, filed on Jun. 10, 2003. | ||
| Prior Publication US 2005/0041403 A1, Feb. 24, 2005 | ||
| Int. Cl. H05K 1/11 (2006.01); H05K 1/14 (2006.01) | ||
| U.S. Cl. 361—803 [361/760; 361/785; 174/260] | 13 Claims |
| 1. A circuit module comprising:
a base element CSP microprocessor integrated circuit having upper and lower major surfaces and a set of contacts on the lower
major surface;
a support element CSP memory integrated circuit having at least two major surfaces and comprising a set of contacts, the base
element CSP microprocessor integrated circuit and the support element CSP memory integrated circuit being in a stacked disposition
relative to each other;
a flex circuit comprising a first conductive layer disposed at a first conductive layer level of the flex circuit and a second
conductive layer disposed at a second conductive layer level of the flex circuit, the first conductive layer level having
base element flex contacts and the second conductive layer level having support element flex contacts, the base element flex
contacts at the first conductive layer level being in contact with the set of contacts of the base element CSP microprocessor
integrated circuit and the support element flex contacts at the second conductive layer level being in contact with the set
of contacts of the support element CSP memory integrated circuit;
a heat transference element adhesively connected to the upper major surface of the base element CSP microprocessor integrated
circuit, and the heat transference element is in thermal contact with a heat absorbing structure.
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