| US 7,586,747 B2 | ||
| Scalable subsystem architecture having integrated cooling channels | ||
| Peter C. Salmon, Mountain View, Calif. (US) | ||
| Assigned to Salmon Technologies, LLC., Mountain View, Calif. (US) | ||
| Filed on Jul. 27, 2006, as Appl. No. 11/495,954. | ||
| Claims priority of provisional application 60/704774, filed on Aug. 01, 2005. | ||
| Prior Publication US 2007/0025079 A1, Feb. 01, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—699 [361/715; 361/790; 257/714; 165/80.4] | 15 Claims |
| 1. An electronic subsystem comprising:
a first stackable module including:
a first substrate having first and second surfaces and a first conductive feedthrough extending between the first and second
surfaces;
an integrated circuit mounted on the first substrate;
a second substrate having first and second surfaces and a second conductive feedthrough extending between the first and second
surfaces of the second substrate, the second conductive feedthrough electrically coupled to the first conductive feedthrough;
a cooling channel beneath the first substrate, the cooling channel defined by the first and second substrates;
an interconnector electrically coupled to the first and second conductive feedthroughs, the interconnector forming the electronic
subsystem by permitting the first stackable module to couple to an additional stackable module; and
a ball grid array interface coupled to the interconnector for communication with the first and second stackable modules.
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