| US 7,586,179 B2 | ||
| Wireless semiconductor package for efficient heat dissipation | ||
| Paul Armand Calo, Lapu-Lapu (Philippines); Margie T. Rios, Mandaue (Philippines); Tiburcio A. Maldo, Suzhou (China); JoonSeo Son, Mapo Gu (Korea, Republic of); and Erwin Ian V. Almagro, Dumaguete (Philippines) | ||
| Assigned to Fairchild Semiconductor Corporation, South Portland, Me. (US) | ||
| Filed on Oct. 09, 2007, as Appl. No. 11/869,307. | ||
| Prior Publication US 2009/0091010 A1, Apr. 09, 2009 | ||
| Int. Cl. H01L 23/495 (2006.01); H01L 23/02 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—675 [257/685; 257/707; 257/723; 257/E23.031; 257/E23.037; 257/E23.039; 257/E23.101; 257/E23.103; 257/E23.105] | 13 Claims |
| 1. A multichip module for wirelessly connecting two or more dies to three external leads comprising:
a heat sink having first and second surfaces and comprising a thermally and electrically conductive material;
first and second dies, each die having at least one terminal on its upper surface and one terminal on its lower surface, said
dies attached to one of the surfaces of the heat sink to establish an electrical connection between the terminals and the
heat sink;
a lead frame comprising three elongated leads, each lead having a die attach pad at one end that is disposed inside a packaging
material and the other end extending from the packaging material, wherein
a first lead has its die attach pad connected to the first die,
a second lead has its die attach pad connected to the second die and
a third lead has its die attach pad connected to the heat sink, whereby the first lead provides an external connection to
the first die, the second lead provides an external connection to the second die, and the third lead provides an external
connection to the electrical connection of the terminals on the lower surfaces of the dies; and
the packaging material encapsulating a portion of the leads, the dies and the heat sink and leaving exposed the other surface
of the heat sink for transferring heat from the dies to the ambient surroundings.
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