| US 7,585,907 B2 | ||
| Inorganic powder-containing resin composition, a film-forming material layer, a transfer sheet, method of producing a substrate having a dielectric layer formed thereon, and a substrate having a dielectric layer formed thereon | ||
| Tomohide Banba, Ibaraki (Japan); Katsuya Kume, Ibaraki (Japan); Makoto Kai, Ibaraki (Japan); Natsuki Kobayashi, Ibaraki (Japan); Mami Ikeya, Ibaraki (Japan); Yasushi Buzoujima, Ibaraki (Japan); Junichi Sekiya, Ibaraki (Japan); and Mitsuhiro Kanada, Ibaraki (Japan) | ||
| Assigned to Nitto Denko Corporation, Osaka (Japan) | ||
| Appl. No. 10/565,565 PCT Filed Jul. 23, 2004, PCT No. PCT/JP2004/010483 § 371(c)(1), (2), (4) Date Jan. 23, 2006, PCT Pub. No. WO2005/010092, PCT Pub. Date Feb. 03, 2005. |
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| Claims priority of application No. 2003-279206 (JP), filed on Jul. 24, 2003. | ||
| Prior Publication US 2006/0199883 A1, Sep. 07, 2006 | ||
| Int. Cl. C08K 5/521 (2006.01) | ||
| U.S. Cl. 524—145 [524/140; 524/141] | 14 Claims |
1. A dielectric inorganic powder-containing resin composition comprising inorganic powder, a binder resin, and a phosphorus
compound represented by formula (1):
 wherein R1, R2 and R3 independently represent H, an alkyl group, an alkylaryl group or —(CH2CH2O)n—R4, wherein n is 1 to 15, and R4 represents H, an alkyl group, an alkylaryl group or a (meth)acryloyl group, and
wherein the binder resin is (meth)acrylic resin,
wherein the (meth)acrylic resin has a carboxyl group and has an acid value of 0.5 to 5 KOH mg/g.
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