US 7,585,380 B2
	High purity tantalum, products containing the same, and methods of making the same
Christopher A. Michaluk, Gilbertsville, Pa. (US); Louis E. Huber, Allentown, Pa. (US); Mark N. Kawchak, Phoenixville, Pa. (US); and James D. Maguire, Jr., Norristown, Pa. (US)
Assigned to Cabot Corporation, Boston, Mass. (US)
Filed on Dec. 17, 2002, as Appl. No. 10/320,980.
Application 10/320980 is a continuation of application No. 10/145336, filed on May 14, 2002, granted, now 7,431,782.
Application 10/145336 is a continuation of application No. 09/922815, filed on Aug. 06, 2001, granted, now 6,893,513.
Application 09/922815 is a continuation of application No. 09/199569, filed on Nov. 25, 1998, granted, now 6,348,113.
Prior Publication US 2003/0168131 A1, Sep. 11, 2003
Int. Cl. C22F 1/18 (2006.01); C22B 3/44 (2006.01)

U.S. Cl. 148—422  [75/622; 148/668; 420/427]

45 Claims

1. A sputtering target having a thickness of from about 0.080 to about 1.50 inches comprising tantalum metal in the shape of a sputtering target having a) an average grain size of about 50 microns or less and b) a texture throughout the thickness of the sputtering target in which a natural log ratio of (111):(100) center peak intensities of greater than about 0, wherein said tantalum metal is obtained from tantalum powder having a metal purity of 99.50% to 99.99%.