US 7,585,340 B2
Polishing composition containing polyether amine
Jeffrey M. Dysard, St. Charles, Ill. (US); Paul M. Feeney, Aurora, Ill. (US); Sriram P. Anjur, Aurora, Ill. (US); Timothy P. Johns, Naperville, Ill. (US); Yun-Biao Xin, Petaluma, Calif. (US); and Li Wang, Aurora, Ill. (US)
Assigned to Cabot Microelectronics Corporation, Aurora, Ill. (US)
Filed on Apr. 27, 2006, as Appl. No. 11/412,369.
Prior Publication US 2007/0251155 A1, Nov. 01, 2007
Int. Cl. C09K 3/14 (2006.01); B24B 7/19 (2006.01); B24D 11/00 (2006.01)
U.S. Cl. 51—298  [51/307; 451/41; 451/526] 7 Claims
OG exemplary drawing
 
1. A chemical-mechanical polishing composition comprising:
(a) an abrasive,
(b) a liquid carrier, and
(c) a compound selected from the group consisting of
(1) a compound of the Formula (I)

OG Complex Work Unit Drawing
wherein x=2-6,
(2) a compound of the Formula (II)

OG Complex Work Unit Drawing
wherein x+z=2-4 and y=1-50, and
(3) combinations thereof, wherein the concentration of the compound is about 50 ppm to about 1200 ppm.