| US 7,584,535 B2 | ||
| Method of manufacturing multi-layer wiring board | ||
| Takehito Tsukamoto, Tokyo (Japan); Hiroshi Matsuzawa, Tokyo (Japan); Satoshi Akimoto, Tokyo (Japan); Masataka Maehara, Tokyo (Japan); Takumi Suemoto, Tokyo (Japan); Masayuki Ode, Tokyo (Japan); and Yuichi Sakaki, Tokyo (Japan) | ||
| Assigned to Toppan Printing Co., Ltd., Tokyo (Japan) | ||
| Filed on Mar. 27, 2007, as Appl. No. 11/727,630. | ||
| Application 11/727630 is a division of application No. 10/808502, filed on Mar. 25, 2004, abandoned. | ||
| Application 10/808502 is a continuation of application No. PCT/JP02/10172, filed on Sep. 30, 2002. | ||
| Claims priority of application No. 2001-304651 (JP), filed on Sep. 28, 2001. | ||
| Prior Publication US 2007/0175025 A1, Aug. 02, 2007 | ||
| Int. Cl. H05K 3/36 (2006.01) | ||
| U.S. Cl. 29—830 [29/831; 29/846; 29/852] | 17 Claims |
| 1. A method of manufacturing a multi-layer circuit wiring board, said method comprising:
forming a first via-contact hole in a first film having a first conductor layer formed on one surface thereof and a second
conductor layer formed on another surface thereof, by using a laser beam, said first via-contact hole passing through the
first conductor layer and first film and not passing through the second conductor layer;
performing an electrolytic plating to bury the first via-contact hole with a metal thus forming a first via-contact layer
electrically connecting said first conductor layer with said second conductor layer;
forming a first wiring pattern in said first conductor layer, and forming a second wiring pattern in said second conductor
layer;
laminating a second film having a first insulating layer and a third conductor layer formed on said first insulating layer
on said one surface of said first film in such a manner that said first insulating layer is in contact with said one surface
of said first film, after that or simultaneously laminating a third film having a second insulating layer and a fourth conductor
layer formed on said second insulating layer on the other surface of said first film in such a manner that said second insulating
layer is in contact with said other surface of said first film;
forming a second via-contact hole in said second film, by using a laser beam, said second via-contact hole passing through
the third conductor layer and first insulating film and reaching the first wiring pattern;
forming a third via-contact hole in a third film, by using a laser beam, said third via-contact hole passing through the fourth
conductor layer and second insulating film and reaching the second wiring pattern;
performing an electrolytic plating to bury the second via-contact hole and third via-contact hole with a metal thus forming
a second via-contact layer electrically connecting said first wiring pattern with said third conductor layer, and third via-contact
layer electrically connecting said second wiring pattern with said fourth conductor layer;
forming a third wiring pattern for mounting an IC on said third conductor layer; and
forming a fourth wiring pattern to be electrically connected with a printed wiring board on said fourth conductor layer.
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