US 11,744,039 B2
System and method for transferring thermal energy from integrated circuits
Adrian Albert van Wijk, Vancouver (CA); and Nikolas Lyman Henderson Radosevic, Vancouver (CA)
Assigned to JDI Design Inc., Vancouver (CA)
Filed by JDi Design Inc., Vancouver (CA)
Filed on Aug. 31, 2021, as Appl. No. 17/462,815.
Claims priority of provisional application 63/075,037, filed on Sep. 4, 2020.
Prior Publication US 2022/0394880 A1, Dec. 8, 2022
Int. Cl. H05K 7/20 (2006.01); F24D 11/00 (2022.01)
CPC H05K 7/20272 (2013.01) [F24D 11/005 (2013.01); F24D 2200/29 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A system for transferring recycling waste heat from integrated circuits, comprising:
an enclosure containing the integrated circuits and a first cooling liquid;
a heat exchanger;
a first fluid circuit in a closed loop with the enclosure and the heat exchanger, wherein the first cooling liquid is circulated through the first fluid circuit to cool the first cooling liquid as it circulates through the heat exchanger and dissipates waste heat from the integrated circuits;
a second fluid circuit connected to the heat exchanger and a heated appliance, wherein a second liquid is circulated through the second fluid circuit and passes through the heat exchanger, wherein waste heat dissipated from the integrated circuits by the first liquid is transferred to the second liquid circulating through the heat exchanger to the heated appliance;
a temperature sensor in the second fluid circuit for measuring a temperature in the second fluid circuit;
a fluid flow control means in the second circuit; and
a control module operatively connected to receive temperature data from the temperature sensor in the second fluid circuit and generating control signals to the fluid flow control means in the second circuit to adjust the flow rate of the second liquid to obtain a desired heat transfer rate to deliver a regulated temperature to the appliance and the integrated circuits.