US 11,744,015 B2
Interposer and method for producing holes in an interposer
Oliver Jackl, Alfeld (DE)
Assigned to SCHOTT AG, Mainz (DE)
Filed by Schott AG, Mainz (DE)
Filed on Oct. 11, 2019, as Appl. No. 16/600,191.
Application 16/600,191 is a division of application No. 13/807,386, abandoned, previously published as PCT/EP2011/003300, filed on Jul. 4, 2011.
Claims priority of application No. 10 2010 025 966.7 (DE), filed on Jul. 2, 2010.
Prior Publication US 2020/0045817 A1, Feb. 6, 2020
Int. Cl. H05K 1/11 (2006.01); H05K 3/00 (2006.01); B23K 26/00 (2014.01); H01L 23/15 (2006.01); B23K 26/14 (2014.01); H01L 23/498 (2006.01); H05K 1/03 (2006.01); B23K 26/12 (2014.01); H01L 21/48 (2006.01); B23K 26/384 (2014.01); B23K 26/382 (2014.01); B23K 26/0622 (2014.01); B23K 26/40 (2014.01); B23K 26/38 (2014.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01)
CPC H05K 1/115 (2013.01) [B23K 26/0093 (2013.01); B23K 26/0622 (2015.10); B23K 26/126 (2013.01); B23K 26/14 (2013.01); B23K 26/38 (2013.01); B23K 26/382 (2015.10); B23K 26/384 (2015.10); B23K 26/40 (2013.01); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H05K 1/0306 (2013.01); H05K 3/0029 (2013.01); B23K 2101/40 (2018.08); B23K 2103/42 (2018.08); B23K 2103/50 (2018.08); H01L 2924/0002 (2013.01); H05K 3/0017 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/087 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method for producing holes in a board-shaped base substrate of an interposer which is adapted for electrical connection between a CPU chip and a circuit board, the method comprising the steps of:
providing the board-shaped base substrate to be perforated, the board-shaped base substrate being made of glass and having a first board surface and a second board surface opposite the first board surface;
aligning laser beams to predetermined perforation points of the board-shaped base substrate;
triggering focused laser pulses in a wavelength range between 1600 and 200 nm in which the glass is at least partially transparent so that laser beams penetrate into the glass and are not absorbed in the surface layer of the glass and with a radiation intensity that causes local only non-thermal destruction of the glass along filamentary channels at the predetermined perforation points; and
widening the filamentary channels from both the first and second board surfaces to a desired diameter of the holes so that the holes have a cylindrical shape, wherein the widening comprises etching.