US 11,743,569 B2
Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
Mingzhu Wang, Ningbo (CN); Bojie Zhao, Ningbo (CN); Takehiko Tanaka, Ningbo (CN); Feifan Chen, Ningbo (CN); Qimin Mei, Ningbo (CN); Liang Ding, Ningbo (CN); and Heng Jiang, Ningbo (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang Province (CN)
Filed by NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Filed on Mar. 3, 2022, as Appl. No. 17/685,587.
Application 16/101,509 is a division of application No. 15/460,236, filed on Mar. 16, 2017, granted, now 10,084,949, issued on Sep. 25, 2018.
Application 17/685,587 is a continuation of application No. 16/908,723, filed on Jun. 22, 2020, granted, now 11,303,789.
Application 16/908,723 is a continuation of application No. 16/436,934, filed on Jun. 11, 2019, granted, now 10,735,637, issued on Jul. 15, 2020.
Application 16/436,934 is a continuation of application No. 16/101,509, filed on Aug. 12, 2018, granted, now 10,367,983, issued on Jul. 30, 2019.
Application 15/460,236 is a continuation of application No. 15/075,192, filed on Mar. 20, 2016, granted, now 10,750,071, issued on Jul. 29, 2020.
Claims priority of application No. 201610142925.9 (CN), filed on Mar. 12, 2016; application No. 201610143457.7 (CN), filed on Mar. 12, 2016; application No. 201610148338.0 (CN), filed on Mar. 15, 2016; and application No. 201610149444.0 (CN), filed on Mar. 15, 2016.
Prior Publication US 2022/0191368 A1, Jun. 16, 2022
Int. Cl. H04N 23/57 (2023.01); H01L 27/146 (2006.01); H04N 13/239 (2018.01); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)
CPC H04N 23/57 (2023.01) [H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H04N 13/239 (2018.05); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H01L 2224/48091 (2013.01); H04N 2213/001 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A photosensitive unit for a camera module comprising at least a camera lens, comprising:
a photosensitive portion which comprises a circuit board including a main circuit board and one or more circuit elements, at least a photosensitive sensor which is provided on said circuit board and has a photosensitive area and a non-photosensitive area positioned around a periphery of said photosensitive area, and one or more connecting elements electrically connecting said main circuit board to said non-photosensitive area of said photosensitive sensor;
an encapsulation portion which is integrally molded to form a support on said main circuit board and extended to said non-photosensitive area of said photosensitive sensor so as to overlappedly affix said photosensitive sensor on said main circuit board by means of molding, said encapsulation portion being protrudingly formed on said non-photosensitive area and surrounding said photosensitive area of said photosensitive sensor to form a lower covering section, an upper installing section and at least an annular inclined inner wall upwardly and outwardly extending from said non-photosensitive area of said photosensitive sensor to said installing section to define a window above said photosensitive area of said photosensitive sensor, wherein said covering section of said encapsulation portion is molded to have an integral enclosure connection with said main circuit board and to cover, encapsulate and wrap up said circuit elements and said connecting elements, wherein said installing section is adapted for enabling the camera lens to be installed thereon and aligned at a photosensitive path of said photosensitive sensor and positioned above said window; and
a motor unit mounted on a top surface of said encapsulation portion and electrically connected to said main circuit board;
wherein a molding area of said encapsulation portion is extended inwardly to reduce outer structural portions of said encapsulation portion and said main circuit board, and to reserve a terminal slot for accommodating a motor terminal of the motor unit on top of said encapsulation portion.