US 11,742,824 B2
Bulk acoustic resonator with heat dissipation structure and fabrication process
Linping Li, Zhejiang (CN); Jinghao Sheng, Zhejiang (CN); and Zhou Jiang, Zhejiang (CN)
Assigned to JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
Appl. No. 17/798,345
Filed by JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD., Zhejiang (CN)
PCT Filed Aug. 12, 2020, PCT No. PCT/CN2020/108710
§ 371(c)(1), (2) Date Aug. 9, 2022,
PCT Pub. No. WO2021/169187, PCT Pub. Date Sep. 2, 2021.
Claims priority of application No. 202010125577.0 (CN), filed on Feb. 27, 2020.
Prior Publication US 2023/0076029 A1, Mar. 9, 2023
Int. Cl. H03H 9/02 (2006.01); H03H 3/02 (2006.01); H03H 9/13 (2006.01); H03H 9/17 (2006.01); H03H 9/54 (2006.01)
CPC H03H 9/02102 (2013.01) [H03H 3/02 (2013.01); H03H 9/131 (2013.01); H03H 9/133 (2013.01); H03H 9/173 (2013.01); H03H 9/54 (2013.01); H03H 2003/021 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A bulk acoustic resonator with a heat dissipation structure, comprising a substrate, a metal heat dissipation layer formed on the substrate and provided with an insulating layer on a surface of the metal heat dissipation layer, and a resonance function layer formed on the insulating layer, wherein the metal heat dissipation layer and the insulating layer define a cavity on the substrate, a side wall of the cavity is formed by the insulating layer, and a bottom electrode layer in the resonance function layer covers the cavity.