US 11,742,462 B2
Display device and manufacturing method thereof
Deukseok Chung, Yongin-si (KR); and Shin Ae Jun, Seongnam-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 8, 2022, as Appl. No. 17/689,011.
Application 17/689,011 is a division of application No. 16/714,950, filed on Dec. 16, 2019, granted, now 11,302,850.
Claims priority of application No. 10-2018-0164051 (KR), filed on Dec. 18, 2018.
Prior Publication US 2022/0190212 A1, Jun. 16, 2022
Int. Cl. H01L 33/50 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/44 (2010.01)
CPC H01L 33/504 (2013.01) [H01L 25/0753 (2013.01); H01L 33/44 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 2933/0041 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method for manufacturing a display device, the method comprising:
providing a light emitting element layer including a plurality of light emitting elements, on a substrate;
providing a first photosensitive resin layer on the light emitting element layer;
providing a passivation layer between the light emitting element layer and the first photosensitive resin layer;
driving a plurality of first light emitting elements among the plurality of light emitting elements, the driving of the plurality of first light emitting elements hardening a portion of the first photosensitive resin layer which corresponds to the plurality of first light emitting elements and faces the plurality of first light emitting elements with the passivation layer therebetween; and
providing on the plurality of first light emitting elements and the passivation layer, a plurality of first color converting patterns as the portion of the first photosensitive resin layer which is hardened, by removing a remaining portion of the first photosensitive resin layer except for the portion of the first photosensitive resin layer which is hardened.