US 11,742,296 B2
Electronic package and manufacturing method thereof
Wei-Jhen Chen, Taichung (TW); Chih-Hsun Hsu, Taichung (TW); Yuan-Hung Hsu, Taichung (TW); Chih-Nan Lin, Taichung (TW); Chang-Fu Lin, Taichung (TW); Don-Son Jiang, Taichung (TW); Chih-Ming Huang, Taichung (TW); and Yi-Hsin Chen, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Dec. 28, 2020, as Appl. No. 17/134,925.
Claims priority of application No. 109139525 (TW), filed on Nov. 12, 2020.
Prior Publication US 2022/0148975 A1, May 12, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01)
CPC H01L 23/5386 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 21/6835 (2013.01); H01L 23/3157 (2013.01); H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/18161 (2013.01)] 8 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
an encapsulation layer having a first surface and a second surface opposite to each other;
a plurality of conductive pillars embedded in the encapsulation layer; and
an electronic structure embedded in the encapsulation layer and including:
an electronic body having a first side and a second side opposite to each other, and including a base and a circuit portion formed on the base, wherein the second side is defined by the base, and the first side is defined by the circuit portion, and the base includes a plurality of conductive vias electrically connected to the circuit portion and exposed from the second side;
a plurality of first conductors formed on the first side of the electronic body to electrically connect with the circuit portion;
a plurality of second conductors formed on the second side of the electronic body to electrically connect with the conductive vias;
a bonding layer formed on the first side of the electronic body to cover the first conductors, wherein the bonding layer is a film body of a non-conductive film such that side surfaces of the bonding layer are straight, and a material of the bonding layer is different from a material of the encapsulation layer;
an insulating layer formed on the second side of the electronic body to cover the second conductors;
a plurality of auxiliary conductors formed on each of the plurality of first conductors and covered by the bonding layer; and
a circuit structure formed on the first surface of the encapsulation layer and electrically connected with the plurality of conductive pillars and the electronic structure, wherein the circuit structure includes a plurality of dielectric layers and a plurality of conducive bumps are formed on the dielectric layers, such that the auxillary conductors are bonded to the conductive bumps through a surface treatment layer, and the bonding layer covers the conductive bumps.