US 11,742,259 B2
Circuit board with phase change material
Manish Arora, Santa Clara, CA (US); and Nuwan Jayasena, Santa Clara, CA (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Jun. 21, 2021, as Appl. No. 17/353,115.
Application 17/353,115 is a continuation of application No. 14/194,701, filed on Mar. 1, 2014, granted, now 11,049,794.
Prior Publication US 2021/0313248 A1, Oct. 7, 2021
Int. Cl. H01L 23/427 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01); H05K 3/34 (2006.01)
CPC H01L 23/4275 (2013.01) [H05K 1/0203 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15312 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 3/3436 (2013.01); H05K 3/4697 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a first semiconductor chip, a second semiconductor chip, and a circuit board, wherein:
the first semiconductor chip is mounted on and electrically coupled to the second semiconductor chip;
the second semiconductor chip is mounted on and electrically coupled to the circuit board; and
the circuit board comprises a first means for holding a phase change material and plural pins, wherein the plural pins project into the circuit board to make thermal contact with the first means for holding the phase change material and project out of the circuit board to make thermal contact with the second semiconductor chip.