CPC H01L 21/67051 (2013.01) [B08B 3/024 (2013.01); B08B 5/02 (2013.01); B08B 7/0057 (2013.01); B08B 7/04 (2013.01); G03F 7/30 (2013.01); B08B 2203/005 (2013.01)] | 19 Claims |
1. A method of removing a photoresist, comprising:
ejecting a solution onto the photoresist on a substrate from a slit of a nozzle;
irradiating ultraviolet light onto the ejected solution using an ultraviolet emitter; and
spraying a fluid onto a bottom surface of the substrate to heat the substrate;
wherein the substrate comprises a center region and an edge region surrounding the center region,
the slit of the nozzle overlaps the center region and the edge region of the substrate.
|