US 11,742,222 B2
Apparatus for removing a photoresist and apparatus for manufacturing a comiconductor device
Jihun Cheon, Suwon-si (KR); Hyun Jung Lee, Suwon-si (KR); Pyojin Jeon, Suwon-si (KR); Yong-Jhin Cho, Suwon-si (KR); and Wonjun Lee, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Nov. 21, 2022, as Appl. No. 18/57,397.
Application 18/057,397 is a division of application No. 16/715,123, filed on Dec. 16, 2019, granted, now 11,545,373, issued on Jan. 3, 2023.
Claims priority of application No. 10-2019-0058816 (KR), filed on May 20, 2019.
Prior Publication US 2023/0097611 A1, Mar. 30, 2023
Int. Cl. H01L 21/67 (2006.01); B08B 7/00 (2006.01); B08B 3/02 (2006.01); B08B 7/04 (2006.01); G03F 7/30 (2006.01); B08B 5/02 (2006.01)
CPC H01L 21/67051 (2013.01) [B08B 3/024 (2013.01); B08B 5/02 (2013.01); B08B 7/0057 (2013.01); B08B 7/04 (2013.01); G03F 7/30 (2013.01); B08B 2203/005 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of removing a photoresist, comprising:
ejecting a solution onto the photoresist on a substrate from a slit of a nozzle;
irradiating ultraviolet light onto the ejected solution using an ultraviolet emitter; and
spraying a fluid onto a bottom surface of the substrate to heat the substrate;
wherein the substrate comprises a center region and an edge region surrounding the center region,
the slit of the nozzle overlaps the center region and the edge region of the substrate.