US 11,741,596 B2
Semiconductor wafer fault analysis system and operation method thereof
Min-Chul Park, Hwaseong-si (KR); Ami Ma, Suwon-si (KR); Jisu Ryu, Hwaseong-si (KR); and Changwook Jeong, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 11, 2019, as Appl. No. 16/599,733.
Claims priority of application No. 10-2018-0153781 (KR), filed on Dec. 3, 2018.
Prior Publication US 2020/0175665 A1, Jun. 4, 2020
Int. Cl. G06K 9/00 (2022.01); G06T 7/00 (2017.01); H01L 21/67 (2006.01); G01N 21/956 (2006.01); G01N 21/95 (2006.01); G06T 5/00 (2006.01); G01N 21/88 (2006.01); G06V 10/70 (2022.01); G06V 10/82 (2022.01); G06V 10/74 (2022.01)
CPC G06T 7/001 (2013.01) [G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G06T 5/002 (2013.01); G06T 7/0004 (2013.01); G06V 10/70 (2022.01); G06V 10/74 (2022.01); G06V 10/82 (2022.01); H01L 21/67288 (2013.01); G01N 2021/8854 (2013.01); G01N 2021/8867 (2013.01); G01N 2021/95615 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/30141 (2013.01); G06T 2207/30148 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor wafer fault analysis system comprising a computer having a processor and a storage, the computer functioning as:
a database to store a first reference map of a wafer, which is classified as a first fault type, and a second reference map of a wafer, which is classified as a second fault type;
a first auto-encoder/decoder to remove a noise corresponding to the first fault type from the first reference map to generate a first pre-processed reference map;
a second auto-encoder/decoder to remove a noise corresponding to the second fault type from the second reference map to generate a second pre-processed reference map; and
a fault type analyzer, wherein:
the database is updated based on the first and second pre-processed reference maps, and
the fault type analyzer is to classify a fault type of a target map based on a comparison with the updated database, the target map being generated by measuring a target wafer,
wherein the fault type analyzer includes:
a linear classificator to compare the target map with the first reference map and the second reference map in the updated database and to classify the fault type of the target map; and
an auto-encoding/decoding classificator, wherein,
when the fault type of the target map is not classified by the linear classificator, the auto-encoding/decoding classificator is to compare the target map with the first and second pre-processed reference maps in the updated database and to classify the fault type of the target map.