US 11,740,559 B2
Apparatuses for reducing metal residue in edge bead region from metal-containing resists
Mollie Waller, Corvallis, OR (US); Brian J. Cardineau, Corvallis, OR (US); Kai Jiang, Corvallis, OR (US); Alan J. Telecky, Albany, OR (US); Stephen T. Meyers, Corvallis, OR (US); and Benjamin L. Clark, Corvallis, OR (US)
Assigned to Inpria Corporation, Corvallis, OR (US)
Filed by Inpria Corporation, Corvallis, OR (US)
Filed on Oct. 11, 2021, as Appl. No. 17/498,437.
Application 16/810,924 is a division of application No. 15/674,934, filed on Aug. 11, 2017, granted, now 10,627,719, issued on Apr. 21, 2020.
Application 17/498,437 is a continuation of application No. 16/810,924, filed on Mar. 6, 2020, granted, now 11,187,986.
Claims priority of provisional application 62/430,722, filed on Dec. 6, 2016.
Claims priority of provisional application 62/374,582, filed on Aug. 12, 2016.
Prior Publication US 2022/0028685 A1, Jan. 27, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 21/67 (2006.01); G03F 7/42 (2006.01); G03F 7/16 (2006.01); G03F 7/004 (2006.01)
CPC G03F 7/422 (2013.01) [G03F 7/0042 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); H01L 21/0273 (2013.01); H01L 21/02087 (2013.01); H01L 21/67051 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of cleaning a substrate provided with a metal-based resist, the method comprising cleaning a substrate provided with a metal-based resist comprising at least one metal selected from the group consisting of Sn, Hf, Zr, In, Te, Sb, Ni, Co, Ti, W, Ta, and Mo using a metal resist cleaning liquid comprising an organic solvent and a carboxylic acid, thereby removing the metal-based resist from the substrate.