US 11,740,553 B2
Method of manufacturing photomask set for forming patterns
Hungbae Ahn, Hwaseong-si (KR); Sangoh Park, Hwaseong-si (KR); and Sunggon Jung, Seongnam-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 26, 2021, as Appl. No. 17/510,665.
Application 17/510,665 is a division of application No. 16/872,444, filed on May 12, 2020, granted, now 11,226,552.
Claims priority of application No. 10-2019-0134791 (KR), filed on Oct. 28, 2019.
Prior Publication US 2022/0043337 A1, Feb. 10, 2022
Int. Cl. H01L 21/033 (2006.01); H01L 21/768 (2006.01); H10B 12/00 (2023.01); G03F 1/70 (2012.01)
CPC G03F 1/70 (2013.01) [H01L 21/0332 (2013.01); H01L 21/76895 (2013.01); H10B 12/03 (2023.02); H10B 12/482 (2023.02); H10B 12/485 (2023.02); H10B 12/488 (2023.02)] 10 Claims
OG exemplary drawing
 
1. A method of manufacturing a photomask set, the method comprising:
preparing a mask layout, the mask layout including a plurality of first layout patterns spaced apart from one another in a first region, and distances between center points of three first layout patterns adjacent to one another from among the plurality of first layout patterns respectively have different values;
grouping pairs of first layout patterns of the plurality of first layout patterns, such that a distance between two first layout patterns adjacent to each other does not have a smallest value, and splitting the mask layout into at least two mask layout patterns; and
forming the photomask set including at least two photomasks, each photomask including a mask pattern corresponding to the first layout pattern included in each of the at least two mask layout patterns.