US 11,739,397 B2
Titanium copper foil, extended copper article, electronic device component, and auto-focus camera module
Kenta Tsujie, Kanagawa (JP)
Assigned to JX Nippon Mining & Metals Corporation, Tokyo (JP)
Appl. No. 17/290,825
Filed by JX Nippon Mining & Metals Corporation, Tokyo (JP)
PCT Filed Aug. 20, 2019, PCT No. PCT/JP2019/032486
§ 371(c)(1), (2) Date May 3, 2021,
PCT Pub. No. WO2020/095508, PCT Pub. Date May 14, 2020.
Claims priority of application No. 2018-211777 (JP), filed on Nov. 9, 2018.
Prior Publication US 2021/0371957 A1, Dec. 2, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C22C 9/00 (2006.01); C21D 9/02 (2006.01); C22F 1/08 (2006.01); G03B 3/10 (2021.01)
CPC C22C 9/00 (2013.01) [C21D 9/02 (2013.01); C22F 1/08 (2013.01); G03B 3/10 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A titanium copper foil comprising from 1.5% by mass to 5.0% by mass of Ti, the balance being Cu and inevitable impurities, wherein in a Ti concentration curve obtained by analyzing a cross section parallel to a rolling direction along a thickness direction by STEM-EDX, a lower concentration Ti layer having a Ti concentration less than an average value of Ti concentrations in the Ti concentration curve and a higher concentration Ti layer having a Ti concentration equal to or higher than the average value of the Ti concentrations in the Ti concentration curve are alternately present in a thickness direction, and wherein the titanium copper foil satisfies 1.0% by mass≤HH≤30% by mass, and HH/HL≥1.1, in which HH and HL are as defined in the present specification.