| US 7,583,871 B1 | ||
| Substrates for optical die structures | ||
| Omar J. Bchir, 1024 E. Frye Rd. Unit 1035, Phoenix, Ariz. 85048 (US); Islam Salama, 4435 E. Cherry Hills Dr., Chandler, Ariz. 85249 (US); Charan Gurumurthy, 504 N. Swallow La., Higley, Ariz. 85236 (US); Houssam Jomaa, 4344 E. Muirwood Dr., Phoenix, Ariz. 85048 (US); Ravi Nalla, 4344 E. Muirwood Dr., Chandler, Ariz. 85048 (US); and Yonggang Li, 343 W. Canary Way, Chandler, Ariz. 85248 (US) | ||
| Filed on Mar. 20, 2008, as Appl. No. 12/52,637. | ||
| Int. Cl. G02B 6/12 (2006.01); H01L 21/00 (2006.01) | ||
| U.S. Cl. 385—14 [385/49; 385/88; 385/89; 385/92; 438/26; 438/27; 438/29; 438/31] | 23 Claims |
| 1. An apparatus comprising:
a package substrate comprising one or more plated through hole (PTH) structures;
an optical waveguide coupled with the package substrate, the optical waveguide comprising one or more input/output (I/O) optical
signal pathways to route I/O signals to and from the package substrate; and
one or more optical fibers coupled with the optical waveguide, the one or more optical fibers being disposed in the PTH structures
to route I/O signals to and from the package substrate.
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