| US 7,583,512 B2 | ||
| Printed circuit board including embedded passive component | ||
| Chang Sup Ryu, Daejeon (Korea, Republic of); and Myung Sam Kang, Daejeon (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyunggi-Do (Korea, Republic of) | ||
| Filed on Jan. 31, 2008, as Appl. No. 12/23,616. | ||
| Application 12/023616 is a division of application No. 11/020466, filed on Dec. 22, 2004, granted, now 7,350,296. | ||
| Claims priority of application No. 2004-73822 (KR), filed on Sep. 15, 2004. | ||
| Prior Publication US 2008/0123308 A1, May 29, 2008 | ||
| Int. Cl. H05K 1/16 (2006.01) | ||
| U.S. Cl. 361—765 [361/763; 361/795; 174/260] | 6 Claims |
| 1. A printed circuit board including an embedded passive component, comprising:
at least one circuit layers in which circuit patterns are formed;
at least one insulating resin layer interposed between the circuit layers;
a pair of terminals which is vertically formed through the insulating resin layers, plated with a first conductive material,
and separated from each other by a predetermined distance;
the embedded passive component which is interposed between the pair of terminals and which has electrodes formed on both sides
thereof, the electrodes being separated from the terminals by a predetermined distance and electrically connected to the terminals
through a second conductive material;
at least one second insulating layer laminated on the embedded passive component and the insulating resin layer; and
at least one lower land formed on the at least one insulating layer and contacting the second conductive material.
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