| US 7,583,157 B2 | ||
| Method of manufacturing a temperature compensated oscillator | ||
| Yasuhiro Sakurai, Sayama (Japan) | ||
| Assigned to Citizen Holdings Co., Ltd., Tokyo (Japan) | ||
| Filed on Oct. 10, 2006, as Appl. No. 11/544,622. | ||
| Application 11/544622 is a division of application No. 10/501774, previously published as PCT/JP03/00422, filed on Jan. 20, 2003. | ||
| Claims priority of application No. 2002-11998 (JP), filed on Jan. 21, 2002. | ||
| Prior Publication US 2007/0030084 A1, Feb. 08, 2007 | ||
| Int. Cl. H03L 1/04 (2006.01) | ||
| U.S. Cl. 331—176 [331/44; 331/66] | 9 Claims |
| 1. A method of manufacturing a temperature compensated oscillator comprising the steps of:
assembling an oscillator in which an IC chip constituting a temperature compensation circuit with an oscillation circuit and
a compensation data storage circuit, and a resonator for said oscillation circuit are mounted in a package,
adjusting said resonator so that an oscillation frequency of said oscillation circuit becomes a desired oscillation frequency
in condition that a temperature compensation function of said temperature compensation circuit is disabled, said oscillator
is kept at a reference temperature, and said resonator and said IC chip are mounted in the package,
sealing said resonator hermetically after said step of adjusting said resonator,
creating temperature compensation data and storing it into said compensation data storage circuit, and
enabling said temperature compensation function of said temperature compensation circuit in condition that the temperature
compensation data is stored in said compensation data storage circuit.
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