| US 7,582,542 B2 | ||
| Die attaching method | ||
| Dae-Young Kim, Chungcheongnam-do (Korea, Republic of); and Joung-Min Oh, Chungcheongnam-do (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do (Korea, Republic of) | ||
| Filed on Oct. 24, 2006, as Appl. No. 11/552,416. | ||
| Claims priority of application No. 10-2006-0010713 (KR), filed on Feb. 03, 2006. | ||
| Prior Publication US 2007/0184564 A1, Aug. 09, 2007 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—464 [438/14; 438/15; 257/E23.179] | 14 Claims |
| 11. A method for aligning a wafer for die attaching, the method comprising:
obtaining the wafer including at least one semiconductor die;
mounting the wafer on a wafer carrier tape;
obtaining an unstretched wafer center point and an unstretched wafer radius;
stretching the wafer carrier tape upon which the wafer is mounted;
obtaining a stretched wafer center point and a stretched wafer radius; and
calculating a position of the semiconductor die based at least in part on the unstretched wafer radius and the stretched wafer
radius, wherein calculating the position of the semiconductor die comprises adding the difference between the stretched wafer
radius and the unstretched wafer radius to a reference position.
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