| US 7,582,496 B2 | ||
| LED package using Si substrate and fabricating method thereof | ||
| Sung Jun Lee, Seoul (Korea, Republic of); Woong Lin Hwang, Kyungki-do (Korea, Republic of); Sang Hyun Choi, Seoul (Korea, Republic of); Chang Hyun Lim, Daegu (Korea, Republic of); Ho Joon Park, Seoul (Korea, Republic of); and Seog Moon Choi, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyungki-Do (Korea, Republic of) | ||
| Filed on Dec. 21, 2005, as Appl. No. 11/312,412. | ||
| Claims priority of application No. 10-2005-0026515 (KR), filed on Mar. 30, 2005. | ||
| Prior Publication US 2006/0220036 A1, Oct. 05, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01); H01L 33/00 (2006.01) | ||
| U.S. Cl. 438—26 [257/98] | 18 Claims |
| 1. A fabricating method of an LED package using a Si substrate, comprising:
preparing a Si substrate;
forming a supporting structure by forming an insulating layer on top and bottom surfaces of the Si substrate;
defining a groove in a bottom surface of the supporting structure by partially removing the insulating layer and the Si substrate;
filling a metal filler in the groove defined in the bottom surface of the supporting structure;
forming a plurality of upper electrodes on a top surface of the supporting structure; and
mounting at least one LED on the top surface of the supporting structure in electrical connection with the upper electrodes.
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