| US 7,581,961 B2 | ||
| Method for preventing solder rise to electric contact and electric contact produced by the same | ||
| Tomonari Ohtsuki, Tokyo (Japan); and Katsuya Yamagami, Tokyo (Japan) | ||
| Assigned to Fujikura Ltd., Tokyo (Japan) | ||
| Filed on Aug. 09, 2007, as Appl. No. 11/889,173. | ||
| Claims priority of application No. 2006-250193 (JP), filed on Sep. 15, 2006. | ||
| Prior Publication US 2008/0070014 A1, Mar. 20, 2008 | ||
| Int. Cl. H01R 12/00 (2006.01) | ||
| U.S. Cl. 439—70 [439/88; 439/131; 29/843; 29/860; 29/877; 228/46; 228/200] | 8 Claims |
| 1. An electric contact connected to a copper foil by soldering so as to extend therefrom and having a portion plated with
a noble metal and adapted to contact a mating object,
wherein said electric contact is soldered to said copper foil in a manner that said portion of said electric contact adapted
to contact the mating object is cooled by cooling means in contact with at least said portion of the electric contact, while
a connection portion between said electric contact and said copper foil is heated by heating means, and a U-shaped slit is
provided at position surrounding said electric contact.
|