| US 7,581,853 B2 | ||
| LED package and backlight unit using the same | ||
| Dae Yeon Kim, Kyungki-do (Korea, Republic of); and Young Sam Park, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyungki-do (Korea, Republic of) | ||
| Filed on Nov. 09, 2006, as Appl. No. 11/594,756. | ||
| Claims priority of application No. 10-2005-0126774 (KR), filed on Dec. 21, 2005. | ||
| Prior Publication US 2007/0139931 A1, Jun. 21, 2007 | ||
| Int. Cl. F21V 5/04 (2006.01) | ||
| U.S. Cl. 362—307 [362/231] | 7 Claims |
| 1. A light emitting diode package, comprising:
a housing with a seating recess formed therein;
at least one light emitting diode seated in the seating recess; and
a lens having a convexed upper surface of a predetermined sag covering an upper part of the light emitting diode, the lens
having a beam angle with a Full Width at Half Maximum (FWHM) in the range of at least 120 degrees,
wherein the seating recess has a circular horizontal section and the sag of lens is formed on an upper side of the lens, and
ranges 1/10 to ⅙ of a diameter of the convex upper surface of the upper side.
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