| US 7,581,313 B2 | ||
| Component mounting method and mounter | ||
| Eiichi Hachiya, Fukuoka (Japan); and Tamaki Ogura, Saga (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Appl. No. 11/667,334 PCT Filed Mar. 03, 2006, PCT No. PCT/JP2006/004677 § 371(c)(1), (2), (4) Date May 09, 2007, PCT Pub. No. WO2006/095841, PCT Pub. Date Sep. 14, 2006. |
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| Claims priority of application No. 2005/067189 (JP), filed on Mar. 10, 2005. | ||
| Prior Publication US 2007/0294875 A1, Dec. 27, 2007 | ||
| Int. Cl. H05K 3/30 (2006.01); G01R 31/28 (2006.01); G01B 11/14 (2006.01) | ||
| U.S. Cl. 29—833 [29/832; 29/834; 29/593; 356/614; 356/615] | 6 Claims |
| 1. A component mounting method for use by a mounter having a mounting head that holds and moves a component so as to mount
the component onto a board, said method comprising:
giving an instruction for a camera to start taking an image of the component held on the mounting head, based on a position
of the mounting head;
starting camera exposure by the camera in response to the instruction;
obtaining a movement amount by which the mounting head moves during a time period from when the instruction is given to when
the camera exposure is performed;
obtaining a position of the component based on the movement amount and the image taken by the camera;
correcting a mounting position at which the mounting head is to mount the component, based on the obtained position of the
component; and
mounting the component, whose image has been taken by the camera, at the corrected mounting position.
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