| US 7,581,203 B2 | ||
| Method and apparatus for manufacturing multiple circuit patterns using a multiple project mask | ||
| Reginald C. Farrow, Somerset, N.J. (US); and Warren K. Waskiewicz, Clinton, N.J. (US) | ||
| Assigned to Agere Systems Inc., Allentown, Pa. (US) | ||
| Filed on Jun. 30, 2003, as Appl. No. 10/610,002. | ||
| Prior Publication US 2004/0268272 A1, Dec. 30, 2004 | ||
| Int. Cl. G06F 17/50 (2006.01); G06K 9/00 (2006.01) | ||
| U.S. Cl. 716—21 [382/145] | 18 Claims |
| 1. A method for manufacturing a substrate having a plurality of circuit patterns, said method comprising the steps of:
exposing a substrate to a primary mask having a plurality of circuit patterns to be printed, wherein said plurality of circuit
patterns are surrounded by one or more exclusion regions; and
exposing said substrate to a secondary mask, wherein said secondary mask has a pattern that satisfies at least one design
rule for a subsequent process, wherein said secondary mask pattern corresponds to said exclusion regions.
|