| US 7,580,115 B2 | ||
| Exposure apparatus and method, and device manufacturing method | ||
| Hirohiko Shinonaga, Utsunomiya (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, (Japan) | ||
| Filed on Mar. 07, 2007, as Appl. No. 11/682,958. | ||
| Claims priority of application No. 2006-060912 (JP), filed on Mar. 07, 2006. | ||
| Prior Publication US 2007/0211236 A1, Sep. 13, 2007 | ||
| Int. Cl. G03B 27/54 (2006.01); G03B 27/42 (2006.01) | ||
| U.S. Cl. 355—67 [355/53] | 9 Claims |
| 1. An exposure apparatus for exposing a substrate by scanning a reticle and the substrate relative to each other, said exposure
apparatus comprising:
a projection optical system configured to project a pattern of the reticle onto the substrate; and
a field stop configured to define a slit-shaped exposure area, and to change a length of the exposure area in a scanning direction
in accordance with a change of a length of the exposure area in a direction orthogonal to the scanning direction,
wherein, with regard to said field stop, when the length of the exposure area in the direction orthogonal to the scanning
direction is lengthened, the length of the exposure area in the scanning direction is shortened, and
wherein, with regard to said field stop, when the length of the exposure area in the direction orthogonal to the scanning
direction is shortened, the length of the exposure area in the scanning direction is lengthened.
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