| US 7,579,925 B2 | ||
| Adjusting a characteristic of a conductive via stub in a circuit board | ||
| Jun Fan, San Marcos, Calif. (US); Arthur Ray Alexander, Valley Center, Calif. (US); James Knighten, Poway, Calif. (US); and Norman Smith, San Marcos, Calif. (US) | ||
| Assigned to Teradata US, Inc., Miamisburg, Ohio (US) | ||
| Filed on Nov. 09, 2006, as Appl. No. 11/557,985. | ||
| Prior Publication US 2007/0103251 A1, May 10, 2007 | ||
| Int. Cl. H03H 7/38 (2006.01); H01P 3/08 (2006.01) | ||
| U.S. Cl. 333—33 [333/246] | 6 Claims |
| 1. A circuit board including:
a substrate;
a through-hole in the substrate for carrying a conductive via stub, the stub having an inherent stub characteristic, said
inherent stub characteristic being an inherent resonant frequency; and
a compensation element positioned on the substrate such that when the stub is carried by the through-hole the inherent stub
characteristic is adjusted to define a compensated stub characteristic, said compensated stub characteristic being a compensated
resonant frequency;
wherein the stub includes a primary portion defined on a signal path for transmitting a signal having a predetermined signal
frequency range and the compensated resonant frequency is outside of the predetermined signal frequency range.
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