| US 7,579,855 B2 | ||
| Method for manufacturing electrical contact element for testing electronic device and electrical contact element manufactured thereby | ||
| Oug-Ki Lee, Seoul (Korea, Republic of); Jung Hoon Lee, Kyeonggi-do (Korea, Republic of); and Seong Hoon Jeong, Seoul (Korea, Republic of) | ||
| Assigned to PHICOM Corporation, Gasan-dong, Kumcheon-ku, Seoul (Korea, Republic of) | ||
| Filed on Feb. 13, 2006, as Appl. No. 11/352,658. | ||
| Application 11/352658 is a continuation of application No. 10/350737, filed on Jan. 23, 2003, abandoned. | ||
| Claims priority of application No. 2002-6367 (KR), filed on Feb. 05, 2002; and application No. 2002-68402 (KR), filed on Nov. 06, 2002. | ||
| Prior Publication US 2006/0192581 A1, Aug. 31, 2006 | ||
| Int. Cl. G01R 31/02 (2006.01) | ||
| U.S. Cl. 324—762 [324/754; 324/761] | 22 Claims |
| 1. An electrical contact element for testing an electronic device, comprising:
a beam portion being spaced apart by a predetermined distance void gap from an electronic component and being positioned parallel
to an upper surface of the electronic device; and
a tip portion extending substantially perpendicularly from the beam portion, the tip portion comprising:
a base part connected to the beam portion;
a middle part extending from the base part; and
a contact part extending from the middle part,
wherein the middle part has a substantially constant cross-sectional area along its vertical length,
wherein a cross-sectional area of the base part is greater than the cross-sectional area of the middle part,
wherein a cross-sectional area of the contact part is smaller than the cross-sectional area of the middle part, and
wherein a height from a bottom of the base part to a top of the contact part is greater than a width of the middle part.
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