| US 7,579,680 B2 | ||
| Packaging system for semiconductor devices | ||
| David Chong, Penang (Malaysia); and Hun Kwang Lee, Penang (Malaysia) | ||
| Assigned to Fairchild Semiconductor Corporation, , Del. (US) | ||
| Filed on Aug. 24, 2007, as Appl. No. 11/844,914. | ||
| Application 11/844914 is a division of application No. 10/397436, filed on Mar. 25, 2003, granted, now 7,323,361. | ||
| Claims priority of provisional application 60/368587, filed on Mar. 29, 2002. | ||
| Prior Publication US 2008/0036054 A1, Feb. 14, 2008 | ||
| Int. Cl. H01L 23/06 (2006.01) | ||
| U.S. Cl. 257—684 [257/692; 257/693; 257/694; 257/695; 257/696; 257/779; 257/787; 257/E23.031; 257/E23.039; 257/E23.066] | 14 Claims |
| 1. A semiconductor device, comprising:
a semiconductor die; and
a lead frame attached to the semiconductor die without using a bond wire; wherein the die and the lead frame are substantially encapsulated except for a part of the bottoms of the die and the lead
frame so that any exposed lead frame surface is substantially coplanar with the encapsulation and wherein the device contains
no leads connected to a drain of the die on the drain side of the die.
|