| US 7,579,614 B2 | ||
| Magnetic random access memory | ||
| Yoshiaki Asao, Sagamihara (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Aug. 03, 2007, as Appl. No. 11/833,504. | ||
| Claims priority of application No. 2006-217322 (JP), filed on Aug. 09, 2006. | ||
| Prior Publication US 2008/0035958 A1, Feb. 14, 2008 | ||
| Int. Cl. H01L 27/088 (2006.01) | ||
| U.S. Cl. 257—4 [257/5; 257/295; 257/379; 257/E21.665] | 20 Claims |

| 1. A magnetic random access memory comprising:
a semiconductor substrate having a first projection projecting from a substrate surface, the first projection having an upper
surface, a first side surface and a second side surface opposing each other;
a first gate electrode formed on the first side surface of the first projection;
a second gate electrode formed on the second side surface of the first projection;
a first source diffusion layer formed in the upper surface of the first projection;
a first drain diffusion layer formed in the substrate surface at a root on a side of the first side surface of the first projection;
a second drain diffusion layer formed in the substrate surface at a root on a side of the second side surface of the first
projection;
a first word line formed above the semiconductor substrate;
a second word line formed above the semiconductor substrate;
a first bit line formed above the first word line and the second word line;
a first magnetoresistive effect element formed between the first bit line and the first word line, and connected to the first
bit line;
a second magnetoresistive effect element formed between the first bit line and the second word line, and connected to the
first bit line;
a first contact which connects the first magnetoresistive effect element and the first drain diffusion layer; and
a second contact which connects the second magnetoresistive effect element and the second drain diffusion layer.
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