US 7,579,307 B2
	Cleaner for semiconductor devices
Shigemasa Suga, Noda (Japan); Shigeru Kamon, Noda (Japan); Takashi Yata, Osaka (Japan); and Akihiro Terai, Tokyo (Japan)
Assigned to Kishimoto Sangyo Co., Ltd., Osaka-Shi (Japan); and Fine Polymers Corporation, Tokyo (Japan)
Appl. No. 10/579,141 PCT Filed Nov. 24, 2004, PCT No. PCT/JP2004/017403 § 371(c)(1), (2), (4) Date Dec. 28, 2006, PCT Pub. No. WO2005/052109, PCT Pub. Date Jun. 09, 2005.
Claims priority of application No. 2003-394271 (JP), filed on Nov. 25, 2003.
Prior Publication US 2007/0105735 A1, May 10, 2007
Int. Cl. H01L 21/02 (2006.01)

U.S. Cl. 510—175  [134/1.3]

10 Claims

1. A cleaner that is an aqueous solution containing phosphoric acid, hydrofluoric acid, and ammonia and/or amine and having a pH ranging from 2 to 6, wherein said aqueous solution contains: 0.5 to 25 mass % of phosphoric acid, 0.1 to 10 mass % of ammonia and/or amine, and 0.1 to 5.0 mass % of hydrofluoric acid.